About

  • Expertise in structure-process-property relationships, rheology, and polymer/composite development.

  • Skilled in wafer and panel-level packaging: fan-in, fan-out, flip-chip, die embedding.

  • Experienced with domestic and international cross-functional teams.

Professional Experience

Associate Professor

  • February 2020 - Current

INDIAN INSTITUTE OF TECHNOLOGY JODHPUR, Jodhpur, Rajasthan, India Department of Chemical Engineering Research Areas: Polymer nanocomposites for electronic packaging and healthcare

Research Packaging Engineer

  • August 2016 - May 2018

FUJIFILM ELECTRONIC MATERIALS, North Kingstown, RI, USADeveloped materials for advanced electronic packaging. Successfully formulated a polymer dielectric platform that passed reliability at an industrial consortium led by a partner lab.

Process Integrator/ Project Lead/ Material & Process Development

  • October 2011 - May 2016

INTEL CORPORATION, Chandler, AZ, USA

Substrate Technology Development

  • Contributed to enable high volume manufacturing and competitive advantage for the high-density inter-connect substrates resulting in savings of $4 billion and more.

  • Contributed to the development of coreless and die-embedding technologies starting from ground up to 90% yield in a technology development phase.

  • Awarded with nine departmental, two divisional, one group and seven peer-to-peer recognitions.

Contact Us

Contact Us